 |
| 원래 장소: | CN |
| 브랜드 이름: | SIGNI |
| 인증: | ISO |
| 모델 번호: | ss |
| 최소 주문 수량: | 1대 pc |
|---|---|
| 포장 세부 사항: | 나무 상자 |
| 배달 시간: | 15 일 |
| 지불 조건: | D/A, D/P, T/T, 서부 동맹, MoneyGram |
| 재료: | 다이아몬드 | 애플리케이션: | 사파이어 |
|---|---|---|---|
| OEM: | 예 | 크기: | 필수에 의하여 |
| 하이 라이트: | 8202390000 diamond cup wheel,SiC diamond cup wheel,8202390000 diamond grinding disc |
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Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel
| Name | Diamond Back Grinding Wheel for Silicon Sapphire Wafers cut glass dremel diamond wheel |
| Bond | Vitrified bond |
| HS Code | 8202390000 |
| Products Range |
1. Synthetic diamond powder /natural diamond powder electroplated diamond disc |
| Features | Stable quality Fast delivery Reasonable price OEM/ODM production |
| Logo | Acceptable, can be lettering according to the customers’ requirements. |
| Sample lead time | 3-7 days |
| Delivery time | 7-15 days. Large quantity please contact us to discuss |
| Usage | Mainly used for machining tungsten carbide, PCD, PCBN, ceramic, cermets, crystal tungsten, carbide |
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.
Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.
담당자: Zhao
정확한 표면 폴리싱을 위해 파우더 나노 다이아몬드 30nm Grit을 닦는 연마재
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